R
X
G
页面:
1
2
3
4
5
6
7
8
9
10
Name
Pro Electron
EIAJ
JEDEC
DIN
半导体封装形式
半导体封装形式
半导体封装形式
Name
Pro Electron
EIAJ
Jedec
DIN / IEC
图像
备注
-
SOT172A1
-
-
-
ceramic package
4 leads
-
SOT172D
-
-
-
ceramic package
4 leads
-
SOT172D1
-
-
-
ceramic package
4 leads
-
SOT176-1
-
-
-
SO8
-
SOT186
SC-67
TO-220F
-
TO-220 Full Pack
3 leads, isolated heatsink
exposed tabs
-
SOT186A
SC-67
TO-220F
-
TO-220 Full Pack
3 leads, isolated heatsink
PLCC-44
SOT187-2
EDR-7319
MO-047
112E10
-
PLCC-84
SOT189-3
-
MO-047
112E13
-
-
SOT194
-
-
-
-
-
SOT199
-
TO-247F
-
3 Lead
TO-247F
DIP-24
SOT222-1
-
MO-001
-
-
-
SOT223
SC-73
-
-
-
-
SOT223
-
-
-
SOT223 5 lead
-
SOT223H
-
-
-
-
-
SOT226
-
TO-220AB
-
TO-220
PLCC-52
SOT238-3
-
MO-047
112E11
-
DIP-48
SOT240-1
-
MS-011
-
-
-
SOT246
-
-
-
module case
PLCC-28
SOT261-2
EDR-7319
MS-018
112E08
-
PLCC-28
SOT261-3
-
MO-047
112E08
-
-
SOT262A1
-
-
-
ceramic package
2 mounting holes, 4 leads
-
SOT262A2
-
-
-
ceramic package
2 mounting holes, 4 leads
-
SOT262B
-
-
-
ceramic package
2 mounting holes, 4 leads
-
SOT263B
-
TO-220
-
TO-220
5 leads
SSOP-20
SOT266-1
-
MO-152
-
-
首页
Links
图书馆
封装
缩写
命名规范